IR Thermal Camera: Radiometric
640 x 512 Boson
13.6mm
32⁰ HFOV
MIPI (2-lanes)
MIPI, I2C
EO Visible Camera:
64 MP Sensor
67⁰ HFOV
MIPI (4-lanes),
MIPI, I2C input
Configurable to low-light applications
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Thermal Imager
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Hadron 640R
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Boson 640 x 512 pixels, 12 μm pitch, USB 3.0, 2-lane MIPI |
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Hadron 640+
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Boson+ 640 x 512 pixels, 12 μm pitch, USB 3.0, 2-lane MIPI |
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Hadron 640R+
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Boson+ 640 x 512 pixels, 12 μm pitch, USB 3.0, 2-lane MIPI |
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Sensitivity [NEDT]
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Hadron 640R
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<40 mK |
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Hadron 640+
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<20 mK |
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Hadron 640R+
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<20 mK |
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Temperature Accuracy (Radiometry)
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Hadron 640R
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±5 °C or less, over 0 °C to 100 °C range |
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Hadron 640+
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Non-Radiometric |
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Hadron 640R+
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±5 °C or less, over 0 °C to 100 |
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Part Numbers
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Hadron 640R
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70640AS32-6PMRXX |
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Hadron 640+
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70640AS32-6PAAXP |
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Hadron 640R+
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70640AS32-6PARXP |
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Imaging & Optical
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EO Camera Optics
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EFL 4.8mm, 67° HFOV, F/# 1/2.3 |
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EO Camera Sensor
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9248 x 6944 pixels (64.2 MP), 0.7 μm pitch, 4-lane MIPI |
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EO Camera Video
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Full resolution @ 60Hz |
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Aspect Ratio, Visible
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4 to 3 |
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IMU
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CM20602, I2C or SPI (selectable) |
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IR Camera Optics
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EFL 13.6mm, 32° HFOV, F/# 1.0 |
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IR Camera Video
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Full resolution @ 60Hz |
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Aspect Ratio, Thermal
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5 to 4 |
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Electrical
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Electrical Interface
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Hirose DF40C-50DP-0.4V(51) Example of mating connector: DF40HC(2.5)-50DS-0.4V(51) |
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Power Consumption
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5V supply voltage. Typical power dissipation < 1800mW, Max < 2900mW |
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Mechanical
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Mechanical Interface
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Screw mount to back plate |
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Size [w/o lens]
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5 x 49 x 45 mm (1.38” x 1.93” x 1.77“) |
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Weight
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56 g |
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Environment & Approvals
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Environmental Sealing
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IP54 (with the rear interfaces sealed) |
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Operational & Storage Temperature Range
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-20 °C to +60 °C |
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Tested EMI Performance
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FCC part 15 Class B |
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Software
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Software Drivers*
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NVIDIA Jetson Nano, Qualcomm Snapdragon RB5, Qualcomm Snapdragon 865 *Contact us for latest software drivers |
Coming soon…